Laser Soldering This email address is being protected from spambots. You need JavaScript enabled to view it.

Laser soldering is used to produce very small solder connections.

It is a variant of selective or partial soldering. The contacts to be soldered are heated up by means of a laser beam. The solder is applied prior to the soldering process in the form of a solder paste deposit. This step is performed by means of a print screen process of by solder paste dispensing. Laser soldering is particularly suited when temperature sensitive substrate materials are used, as is the case for chip-card production.